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Heatsinks and semiconductor cooling

Connectors/Brackets/Optoelectronics

19" and case technology

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New press releases

	Male headers for the through hole reflow soldering technique ("THR")
	Attachable heatsinks for TO220 with THIN BASE PLATE 0.5 mm
	Powder coating and laser lettering
	High performance liquid cooler for power modules
	”DH SV ...” quick release junction shells

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Certified quality and environmental awareness

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