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1 - 12 (40)Number:
ick_bga.tif
10 x 10 x 6 mm, for IC design BGA and others
  • particularly suited for Ball Grid Arrays
  • heatsink dimensions match the respective BGA-type
  • can be glued directly on the BGA component
  • double-sided adhesive thermal conductive foil WLF ...
  • surface: black anodised
ick_bga.tif
10 x 10 x 10 mm, for IC design BGA and others
ick_bga.tif
11 x 11 x 6 mm, for IC design BGA and others
ick_bga.tif
11 x 11 x 10 mm, for IC design BGA and others
ick_bga.tif
11 x 11 x 14 mm, for IC design BGA and others
ick_bga.tif
14 x 14 x 6 mm, for IC design BGA and others
ick_bga.tif
14 x 14 x 10 mm, for IC design BGA and others
ick_bga.tif
15 x 15 x 6 mm, for IC design BGA and others
ick_bga.tif
15 x 15 x 10 mm, for IC design BGA and others
ick_bga.tif
15 x 15 x 14 mm, for IC design BGA and others
ick_bga.tif
19 x 19 x 6 mm, for IC design BGA and others
ick_bga.tif
19 x 19 x 10 mm, for IC design BGA and others
1 - 12 (40)Number:

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